E.B. Peerless Ltd.
 
Home >> Chipbonders
 
Stock Code & Application Data Sheets
  
   LOCTITE CHIPBONDER 300ML
(3616(29848))
   Link for Data Sheet
    
   Application
Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.
 
    
  
< Back to Product Catalogue  
©2006 EB Peerless Ltd.| Privacy Policy | Copyright
Website design in Vancouver by Graphically Speaking

FEATURED SUPPLIERS
• 3M
• Huntsman
• Loctite
• LPS
• Dow Corning
• Hysol (Loctite Aerospace)
• PRC-DeSoto (PPG Aerospace)
• Rayovac